Materials

  • Isola 406,408,408HR,370HR,410
  • Polyimide
  • ITEQ IT-180
  • Rogers RO 3000, 4000 series
  • Nelco 4000-29,13-13SI
  • Duroid
  • I-Tera, I-Speed, Megtron
  • Dupont LF, AP, LCP
  • 3M C-Ply
  • FaradFlex
  • Al Clad/ Thermally conductive

Mechanical

  • Aspect Ratio – 15:1
  • Min Drilled hole size – 0.0059”
  • Mechanical Micro-vias 0.004"
  • PTH tolerance - +/- 0.001”
  • Min pad – 0.010”
  • Min line - < 0.003”
  • Min spacing - <0.003”
  • Min board thickness – 0.005”
  • Max board thickness – 0.350”
  • S/M dam – 0.002”

Plating and Circuitry

  • Min dielectric - .002”
  • Min Cu foil – 1/8 oz.
  • Max Cu foil – 5 oz.
  • Internal Cu Max – 5 oz.
  • External Cu max – 10 oz
  • Impedance tol. - +/- 5%
  • Filled Vias
  • Blind / Buried vias
  • Micro-vias and stacked Micro-vias

Certifications / Registration

  • MIL-PRF-31032
  • MIL-PRF-55110
  • ISO 9001-2015
  • AS9100D
  • ITAR
  • UL-94-VO, DSR
  • NADCAP

In-House Surface Finishes

  • ENIG
  • Soft (bondable gold)
  • Hard Gold
  • Sn/Pb HASL
  • LF HASL
  • Immersion Silver, OSP
  • Electrolytic Ni

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