Materials
- Isola 406,408,408HR,370HR,410
- Polyimide
- ITEQ IT-180
- Rogers RO 3000, 4000 series
- Nelco 4000-29,13-13SI
- Duroid
- I-Tera, I-Speed, Megtron
- Dupont LF, AP, LCP
- 3M C-Ply
- FaradFlex
- Al Clad/ Thermally conductive
Mechanical
- Aspect Ratio – 15:1
- Min Drilled hole size – 0.0039”
- Mechanical Micro-vias 0.0039"
- PTH tolerance - +/- 0.001”
- Min pad – 0.010”
- Min line - < 0.003”
- Min spacing - <0.003”
- Min board thickness – 0.005”
- Max board thickness – 0.350”
- S/M dam – 0.002”
Plating and Circuitry
- Min dielectric - .002”
- Min Cu foil – 1/8 oz.
- Max Cu foil – 5 oz.
- Internal Cu Max – 5 oz.
- External Cu max – 10 oz
- Impedance tol. - +/- 5%
- Filled Vias (conductive and non-conductive)
- Blind / Buried vias
- Stacked and Staggered Micro-vias
Surface Final Finishes
- ENIG (Electroless Nickel/Immersion Gold)
- Sn/Pb HASL
- Lead Free HASL
- Immersion Silver
- OSP
- Electrolytic Nickel
- Hard Gold
- Soft Gold (wire bondable)
- Copper (no finish applied)
- Selective Plating Processes Available
- Mixed Finishes Available