Capabilities

Materials

  • Isola 406,408,408HR,370HR,410
  • Polyimide
  • ITEQ IT-180
  • Rogers RO 3000, 4000 series
  • Nelco 4000-29,13-13SI
  • Duroid
  • I-Tera, I-Speed, Megtron
  • Dupont LF, AP, LCP
  • 3M C-Ply
  • FaradFlex
  • Al Clad/ Thermally conductive

Mechanical

  • Aspect Ratio – 15:1
  • Min Drilled hole size – 0.0039”
  • Mechanical Micro-vias 0.0039"
  • PTH tolerance - +/- 0.001”
  • Min pad – 0.010”
  • Min line - < 0.003”
  • Min spacing - <0.003”
  • Min board thickness – 0.005”
  • Max board thickness – 0.350”
  • S/M dam – 0.002”

Plating and Circuitry

  • Min dielectric - .002”
  • Min Cu foil – 1/8 oz.
  • Max Cu foil – 5 oz.
  • Internal Cu Max – 5 oz.
  • External Cu max – 10 oz
  • Impedance tol. - +/- 5%
  • Filled Vias (conductive and non-conductive)
  • Blind / Buried vias
  • Stacked and Staggered Micro-vias

Surface Final Finishes

  • ENIG (Electroless Nickel/Immersion Gold)
  • Sn/Pb HASL
  • Lead Free HASL
  • Immersion Silver
  • OSP
  • Electrolytic Nickel
  • Hard Gold
  • Soft Gold (wire bondable)
  • Copper (no finish applied)
  • Selective Plating Processes Available
  • Mixed Finishes Available