| Min Layer Count |
1 |
1 |
1 |
| Max Layer Count |
30 |
30 |
30 |
| Min Board Thickness |
.010” (.254 mm) |
.005” (.127 mm) |
.005” (.127 mm) |
| Max Board Thickness |
.250” (6.35 mm) |
.250” (6.35 mm) |
.250” (6.35 mm) |
| Min Core Thickness |
.004” (.102 mm) |
.002” (.051 mm) |
.002” (.051 mm) |
| Min Dielectric |
.004” (.102 mm) |
.003” (.076 mm) |
.002″ (.051 mm) |
| Min Starting Copper Foil Weight |
9 microns |
9 microns |
5 micron |
| Max Finished Copper Thickness (O/L) |
4 oz (118 ml) |
6 oz (177 ml) |
1 oz (30 ml) |
| Max Finished Copper Thickness (I/L) |
4 oz (118 ml) |
4 oz (118 ml) |
0.5 oz (15 ml) |
| Min Panel Size |
12” x 18” (30 x 46 cm) |
12” x 18” (30 x 46 cm) |
12″ x 18″ (30 x 46 cm) |
| Max Panel Size |
12” x 18” (30 x 46 cm) |
21” x 29” (53 x 74 cm) |
18″ x 24″ (46 x 61 cm) |
| Smallest Mechanical Drill Diameter |
.0059” (.150 mm) |
.0059” (.150 mm) |
.0059″ (.150 mm) |
| Smallest Laser Drill Diameter |
.005″ (.127 mm) |
.004″ (.102 mm) |
.004″ (.102 mm) |
| Min Finished Hole Size |
.004” (.102 mm) |
.002” (.051 mm) |
.002″ (.051 mm) |
| Max Through Hole Aspect Ratio (depending on board thickness and finish hole) |
.010” (.254 mm) |
.005” (.127 mm) |
.005” (.127 mm) |
| Min Board Thickness |
10:1 |
10:1 |
10:1 |
| Max Laser Via Aspect Ratio |
.75:1 |
.75:1 |
.75:1 |
| Blind Via Finished Hole Size |
.004” (.102 mm) |
Plated Shut |
Plated shut |
| Buried Via Finished Hole Size |
.004” (.102 mm) |
.002” (.051 mm) |
.002″ (.051 mm) |
| Min Trace and Space |
.004” (.102 mm) |
.003” (.076 mm) |
.002″ (.051 mm) |
| Min Pad Size for Test |
.005” (.127 mm) |
.005” (.127 mm) |
.005” (.127 mm) |
| Process Pad Diameter |
D + .012” (.305 mm) (1-mil (.025-mm) annular ring) |
D + .008” (.203 mm) (tangency) |
D + .008” (.203 mm) (tangency) |
| Stacked Vias |
Yes |
Yes |
Yes |
| Min Wire Bond Pad Size |
> .006” (.152 mm) |
.004” (.102 mm) |
.004″ (.102 mm) |
| Controlled Impedance Tolerance |
10% |
5% |
5% |
| Solder Mask Registration |
.002” (.051 mm) |
001” (.025 mm) |
.001″ (.025 mm) |
| Solder Mask Feature Tolerance |
.0015” (.038 mm) |
.001” (.025 mm) |
.001” (.025 mm) |
| Solder Mask Min Dam Size (based on green soldermask color) |
.005” (.127 mm) |
.004” (.102 mm) |
.004” (.102 mm) |
| Min Diameter Route Cutter Available |
.024” (.610 mm) |
.021” (.533 mm) |
.021” (.533 mm) |
| Routed Part Size Tolerance |
.005” (.127 mm) |
.003” (.076 mm) |
.003″ (.076 mm) |
| Laser Hole Location Tolerance |
.0005” (.013 mm) |
.0005” (.013 mm) |
.0005″ (.013 mm) |
| Laser Routed Part Size Tolerance ( can only be done with panels .032” thick) |
002” (.051 mm) |
002” (.051 mm) |
.001″ (.025 mm) |
| Bow and Twist Tolerance |
Per IPC spec |
Per IPC spec |
Per IPC spec |
| Thickness Tolerance (based on board thickness) |
10% |
5% |
5% |
| Sequential Laminations |
3 or less lamination cycles |
4 lamination cycles |
5 lamination cycles |
| Buried Vias |
Yes |
Yes |
Yes |
| Blind Vias |
Yes |
Yes |
Yes |
| Conductive Filled Vias |
Yes |
Yes |
Yes – Cu plate shut |
| Non Conductive Filled Vias |
Yes |
Yes |
Yes |
